Method of preparing a high density interconnect printed circuit board including microvias filled with copper

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United States of America

PATENT NO 12245383
APP PUB NO 20220279662A1
SERIAL NO

17636502

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) or IC substrates including through-holes and/or grate structures filled with copper, which comprises the steps of:

    a) providing a multi-layer substrate;b) forming a non-copper conductive layer or a copper layer on the cover layer and on an inner surface of the through-hole, respectively on an inner surface of the grate structure;c) forming a patterned masking film;d) electrodepositing copper;e) removing the masking film; andf) electrodepositing a copper filling.

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Patent Owner(s)

  • ATOTECH DEUTSCHLAND GMBH & CO. KG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Özkök, Akif Berlin, DE 4 4
Berthold, Herwig Josef Berlin, DE 2 0
Brüggmann, Horst Berlin, DE 5 9
Kim, Soungsoo Berlin, DE 5 17
Klobus, Marcin Berlin, DE 3 4
Mirkovic, Marko Berlin, DE 5 5
Reents, Bert Berlin, DE 8 37
Schiwon, Thomas Berlin, DE 4 8

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