Slurry and polishing method

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United States of America

PATENT NO 12247140
APP PUB NO 20220033680A1
SERIAL NO

17278974

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Abstract

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A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, a particle size of the second particles is smaller than a particle size of the first particles, the first particles contain cerium oxide, and the second particles contain a cerium compound.

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Patent Owner(s)

  • RESONAC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Tomoyasu Tokyo, JP 23 106
Iwano, Tomohiro Tokyo, JP 56 332
Kukita, Tomomi Tokyo, JP 20 24
Matsumoto, Takaaki Tokyo, JP 30 156

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