Tackifier-free hot melt adhesive compositions suitable for use in a disposable hygiene article

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12247142
APP PUB NO 20220251429A1
SERIAL NO

17626238

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Abstract

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A hot melt adhesive composition comprises a polypropylene homopolymer having a DSC melting point of less than 100° C.; a butene-based copolymer; and a plasticizer. The butene-based copolymer may comprise a butene-rich amorphous poly-alpha olefin, such as a butene-propylene copolymer, or a semi-crystalline copolymer, such as a butene-ethylene copolymer. The hot melt adhesive is especially useful for bonding substrates which swell or elongate significantly in use. Such uses include adhering superabsorbent polymers to a substrate or adhering together two substrates at least one of which having superabsorbent polymers, such as the top and bottom layer of an absorbent core of a disposable hygiene article, such as a diaper, feminine sanitary napkin, and adult incontinence pad. The hot melt adhesive composition, which does not contain a tackifier, demonstrates suitable elongation at break and stress at yield, with a sufficiently low viscosity, to stabilize an absorbent core having superabsorbent polymers.

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Patent Owner(s)

Patent OwnerAddress
BOSTIK INC11320 WATERTOWN PLANK ROAD WAUWATOSA WI 53226-3413

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gray, Steven D Wauwatosa, US 84 2775
Hussein, Naji Colombes, FR 7 7
Secrist, Kimberly E Wauwatosa, US 11 13

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