Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses

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United States of America

PATENT NO 12247270
APP PUB NO 20210114147A1
SERIAL NO

17255980

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Abstract

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A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.

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Patent Owner(s)

  • RESONAC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akai, Kunihiko Tokyo, JP 25 51
Ejiri, Yoshinori Tokyo, JP 41 146
Miyaji, Masayuki Tokyo, JP 23 274
Moriya, Toshimitsu Tokyo, JP 6 3
Okada, Yuuhei Tokyo, JP 9 45
Sukata, Shinichirou Tokyo, JP 15 24

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