Semiconductor device, method of manufacturing the same and electronic device including the device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12249544
APP PUB NO 20230369489A1
SERIAL NO

18317722

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Abstract

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There are provided a semiconductor device, a method of manufacturing the same, and an electronic device including the device. According to an embodiment, the semiconductor device may include a substrate, and a first device and a second device formed on the substrate. Each of the first device and the second device includes a first source/drain layer, a channel layer and a second source/drain layer stacked on the substrate in sequence, and also a gate stack surrounding a periphery of the channel layer. The channel layer of the first device and the channel layer of the second device are substantially co-planar.

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Patent Owner(s)

  • INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhu, Huilong Poughkeepsie, US 705 13304

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