Dielectric substrate and method of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12250767
APP PUB NO 20240023242A1
SERIAL NO

18471816

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Abstract

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The present disclosure relates to a dielectric substrate that may include a polyimide layer and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

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Patent Owner(s)

  • VERSIV COMPOSITES LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adamchuk, Jennifer Marlborough, US 16 48
Besozzi, Theresa M Milford, US 6 22
Buss, Gerard T Bedford, US 23 103

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