Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission

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United States of America

PATENT NO 12251862
APP PUB NO 20240342968A1
SERIAL NO

18632326

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Abstract

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A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) for high-frequency and high-speed signal transmission comprise a surface-treated metal, and the surface-treated metal includes a nano-scale pore array that is used for filling of a resin and vertically extends from a surface to an interior of a metal, where nano-scale pillars are provided to extend from bottoms to openings of nano-scale pores of the nano-scale pore array. The pillar-in-pore structure makes a resin entering a nano-scale pore have an ultra-high anchoring effect on a resin body outside the nano-scale pore. Therefore, on the premise of not using an additive such as a T liquid or a coupling agent, the present disclosure greatly improves a tensile bonding strength at an interface between a resin body and a metal substrate, and also eliminates a decline in an interfacial bonding strength of a composite.

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Patent Owner(s)

  • NANJING UNIVERSITY; JIANGSU HHCK ADVANCED MATERIALS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Wei Nanjing, CN 2011 24064
Han, Jianglong Nanjing, CN 1 0
Li, Linling Nanjing, CN 4 0
Wang, Xiaoliang Nanjing, CN 79 338
Xue, Qi Nanjing, CN 54 1035
Zhou, Dongshan Nanjing, CN 4 1
Zhuang, Huijie Nanjing, CN 1 0

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