Packaging film and preparation method thereof, and filter chip packaging method

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United States of America

PATENT NO 12252613
SERIAL NO

18931127

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Abstract

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A packaging film and a preparation method thereof, and a filter chip packaging method are provided. The raw materials of the packaging film include: 20-24 parts by mass of silicon dioxide, 24-26 parts by mass of aliphatic polyurethane acrylate, 12-15 parts by mass of phenoxy resin, 5-13 parts by mass of flexible liquid epoxy resin, 10 parts by mass of bisphenol F epoxy resin, 17-19 parts by mass of curing agent, 2-5 parts by mass of photoinitiator, and 0.4-0.8 parts by mass of accelerant, where the curing agent is compounded by bisphenol F-based benzoxazine curing agent and dicyandiamide curing agent according to the mass ratio of 10:(7-9). The packaging film has excellent flexibility and adhesion, a low moisture absorption rate, and high heat resistance and is especially suitable for the packaging of filter chips.

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Patent Owner(s)

Patent OwnerAddress
WUHAN CHOICE TECHNOLOGY CO LTDROOM 1710 17F OVERSEAS TALENT BUILDING A NO 999 GAOXIN AVE WUHAN EAST LAKE HI-TECH DEVELOPMENT ZONE WUHAN HUBEI 430000 430000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Ting Wuhan, CN 218 986
Liao, Shuhang Wuhan, CN 15 1
Su, Junxing Wuhan, CN 15 1
Wu, De Wuhan, CN 19 20

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