Curable silicone composition, encapsulant and optical semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12252616
APP PUB NO 20220204771A1
SERIAL NO

17644623

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Abstract

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Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (R13SiO1/2)f(R22SiO2/2)g(R1SiO3/2)h(SiO4/2)i(XO1/2)j wherein R1 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two R1 are alkenyl groups; R2 are independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one R2 is an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 00; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.

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Patent Owner(s)

  • DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA; DUPONT SPECIALTY MATERIALS KOREA LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Horie, Sawako Chiba, JP 3 0
Kang, Hyunji Gyeonggi-Do, KR 7 15
Kobayashi, Akihiko Chiba, JP 69 708
Takeuchi, Kasumi Chiba, JP 21 157
Takeuchi, Shunya Chiba, JP 57 83

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