Polishing liquid and method for manufacturing glass substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12252633
APP PUB NO 20230287244A1
SERIAL NO

18321385

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Abstract

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Letting a particle diameter be Dx (μm) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 μm or less, D100 is 3 μm or more, D50 is 0.8 to 2.4 μm, and Dpeak−D5 is less than D95−Dpeak.

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Patent Owner(s)

  • 501 HOYA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takizawa, Toshio Akishima, JP 37 340

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