Composite material, heat sink and semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12252766
APP PUB NO 20230167528A1
SERIAL NO

17917006

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Abstract

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A composite material of the present disclosure contains a plurality of diamond particles, copper, and at least one first element selected from the group consisting of silicon, chromium, cobalt, nickel, molybdenum, titanium, vanadium, niobium, tantalum tungsten and aluminum, wherein the content rate of the first element based on the total mass of the copper and the first element is 50 ppm or higher and 2,000 ppm or lower.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA-SHI OSAKA 541-0041
A L M T CORPTOKYO 104-0061

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Majima, Masatoshi Osaka, JP 169 532
Takashima, Kouichi Yamagata, JP 13 97
Toyoshima, Gouhei Yamagata, JP 3 4

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