Electronic component mounting substrate, electronic component mounted body, and method of manufacturing the same, as well as electronic apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Mar 18, 2025
Grant Date -
Dec 22, 2022
app pub date -
Dec 1, 2020
filing date -
Dec 1, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component mounted body includes a substrate, a connection section provided on the substrate, an electronic component having a terminal connected to the connection section, and a solder that fixes the electronic component to the connection section. The connection section has a first region in which the terminal is fixed through the solder, and a second region lower in wettability than the first region, and the second region has an extension region extended to a peripheral edge of the connection section, and a spaced region that projects from the extension region toward the first region and that is provided to be spaced from the peripheral edge.
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