Modified internal clearance(s) at connector pin aperture(s) of a circuit board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12256494
APP PUB NO 20240138064A1
SERIAL NO

18048456

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Abstract

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A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjacent to an aperture of the multilayer circuit board. The modified voltage-to-ground clearance of conductive material is based on a configuration of a connector pin to be press-fit connected within the aperture of the multilayer circuit board, and the internal clearance region is enlarged in a direction of greatest normal force outward from the aperture with insertion of the connector pin into the aperture.

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Patent Owner(s)

  • IBM CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bielick, James D Pine Island, US 22 192
Braun, David J St. Charles, US 32 99
Dangler, John R Rochester, US 127 434
Hugo, Stephen Michael Stewartville, US 9 8
Jennings, Timothy Rochester, US 13 9
Lewis, Theron Lee Rochester, US 29 72
Younger, Timothy P Rochester, US 20 27

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