Joining material, production method for joining material, and joined body

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United States of America

PATENT NO 12257622
APP PUB NO 20220347745A1
SERIAL NO

17642901

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Importance

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Abstract

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In the joined body (10) in which the conductor (12) and the substrate (14) are joined by the joining material (13), the joining material (13) includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO 120-8555

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jiu, Jinting Tokyo, JP 12 16

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