Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12258468
APP PUB NO 20210024741A1
SERIAL NO

17043357

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Abstract

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To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirayama, Yuya Tokyo, JP 10 0
Kushida, Keisuke Tokyo, JP 6 2
Shimizu, Hiroshi Tokyo, JP 514 5554
Tomioka, Kenichi Tokyo, JP 28 249

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