Conductive film, method for producing same, conductor, resist pattern formation method, and laminate

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United States of America

PATENT NO 12260969
APP PUB NO 20210005343A1
SERIAL NO

17009870

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The conductive film of the present invention includes a conductive polymer (A) and has a film thickness of 35 nm or less, wherein: a surface resistance of the conductive film is 1×1011 Ω/sq. or less, and a standard deviation of current that flows through the conductive film upon application of voltage to the conductive film is 5 or less. The conductor of the present invention has a substrate, and the conductive film provided on at least a part of the surface of the substrate. The resist pattern forming method of the present invention includes a lamination step of forming the conductive film on a surface of a resist layer including a chemically amplified resist, said resist layer formed on one surface of a substrate, and an exposure step of irradiating the substrate with an electron beam according to a pattern on its side on which the conductive film is formed. The laminate of the present invention has a resist layer and an antistatic film formed on the surface of the resist layer, wherein the antistatic film is the above-mentioned conductive film.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATIONCHIYODA-KU TOKYO 100-8251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Irie, Yoshiko Tokyo, JP 13 41
Makigawa, Saki Tokyo, JP 3 1
Saiki, Shinji Tokyo, JP 20 33
Uzawa, Masashi Tokyo, JP 26 114
Yamada, Naoko Tokyo, JP 20 170
Yamazaki, Akira Tokyo, JP 205 3133

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