Slurry compositions for chemical mechanical planarization

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261055
APP PUB NO 20230058800A1
SERIAL NO

17982028

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The method includes receiving a semiconductor device having a first surface and a second surface. The first surface is a top surface including a conductive material exposed thereon; and the second surface is an embedded surface including the conductive material and a dielectric material. The method also includes selecting a first polishing slurry to achieve a first polishing rate of the conductive material in the first polishing slurry and a second polishing rate of the dielectric material in the first polishing slurry. The method further includes selecting a second polishing slurry to achieve a third polishing rate of the conductive material in the second polishing slurry and a fourth polishing rate of the dielectric material in the second polishing slurry. The method additionally includes polishing the first surface with the first polishing slurry until the second surface is exposed; and polishing the second surface with the second polishing slurry.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Huang-Lin Hsinchu, TW 118 101
Lee, An-Hsuan Hsinchu, TW 15 2
Lee, Shen-Nan Hsinchu County, TW 56 195
Liao, Chun-Hung Hsinchu, TW 31 13
Tsai, Teng-Chun Hsinchu, TW 275 2741
Wu, Chen-Hao Hsinchu, TW 36 31

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 25, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 25, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 25, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00