Wafer processing apparatus and wafer processing method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261076
APP PUB NO 20220344196A1
SERIAL NO

17720760

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Abstract

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A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit in which the first dies of the first wafer part processed in the first chamber unit and the second wafer part processed in the second chamber unit are stacked and pre-bonded.

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Patent Owner(s)

Patent OwnerAddress
ZEUS CO LTD132 ANNYEONGNAM-RO HWASEONG-SI GYEONGGI-DO 18363

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baek, Seung Dae Hwaseong-si, KR 10 8
Kim, Sung Yup Suwon-si, KR 8 9
Park, Jun Goo Hwaseong-si, KR 3 0

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