Chip heat dissipating structure, chip structure, circuit board and supercomputing device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261108
APP PUB NO 20210280504A1
SERIAL NO

17327325

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present application relates to a chip heat dissipating structure, a chip structure, a circuit board and a supercomputing device, and the chip heat dissipating structure includes a plating layer covered on the chip, where the plating layer includes a first metal layer and a second metal layer arranged in sequence. By adding two metal layer on the top of the chip by physical sputtering, the heat sink may be soldered onto the metal layer through a solder layer, so that the heat sink is fixed to the top of the chip; the main component of the solder layer is metal tin, and the metal layer has a higher thermal conductivity than an epoxy resin material mounted on a traditional heat sink, thereby solving a problem of the heat dissipation bottleneck of a resin material in the chip, thus improving a heat dissipation effect of the chip.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
BITMAIN TECHNOLOGIES INC100176 801 FLOOR 8 BUILDING 8 YARD 8 KEGU 1ST STREET BEIJING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE DAXING DISTRICT BEIJING BEIJING CITY BEIJING CITY 100176

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhan, Micree Beijing, CN 3 0
Zhang, Lei Beijing, CN 2799 20393
Zhou, Tao Beijing, CN 131 554
Zou, Tong Beijing, CN 9 472

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 25, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 25, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 25, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00