Semiconductor device package and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261350
APP PUB NO 20230402738A1
SERIAL NO

18231771

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Abstract

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A semiconductor device package is provided that includes a substrate, a first support structure disposed on the substrate and a first antenna. The first support structure includes a first surface spaced apart from the substrate by a first distance. The first antenna is disposed above the first surface of the first support structure. The first antenna has a first surface, a second surface opposite the first surface and a third surface extending from the first surface to the second surface, wherein the first surface and the second surface of the first antenna are exposed.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INCKAOHSIUNG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Yi Chuan Kaohsiung, TW 28 358
Liao, Guo-Cheng Kaohsiung, TW 24 122

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