Packaging of wide bandgap power electronic power stages

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12261489
SERIAL NO

17958093

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Abstract

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Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a connector to connect the first PCB to the second PCB, the connector electrically coupled to the first voltage phase circuit cluster by the cluster of traces.

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Patent Owner(s)

Patent OwnerAddress
DEERE & COMPANYONE JOHN DEERE PLACE MOLINE IL 61265

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Singh, Brij N West Fargo, US 45 335

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