Methods for forming engineered thermal paths of printed circuit boards by use of removable layers

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12262464
APP PUB NO 20220183141A1
SERIAL NO

17543512

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Abstract

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A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.

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Patent Owner(s)

Patent OwnerAddress
TTM TECHNOLOGIES INC200 EAST STANDPOINTE SUITE 400 SANTA ANA CA 92707

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Len, Michael Santa Ana, US 9 4
Leung, King Yip Santa Ana, US 1 0
Neely, Matthew D Santa Ana, US 2 2

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