Chemical mechanical polishing liquid

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United States of America

PATENT NO 12264266
APP PUB NO 20230032899A1
SERIAL NO

17785000

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Abstract

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Disclosed is a chemical mechanical polishing solution containing water, cerium oxide, polyacrylic acid and polyether amine. The chemical mechanical polishing solution in this application uses polyether amine as an additive, which can improve the polishing rate of silicon dioxide by negatively charged cerium oxide.

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Patent Owner(s)

Patent OwnerAddress
ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO LTDT6-9 NO 5001 HUADONG ROAD JINQIAO EXPORT PROCESSING ZONE (SOUTH ZONE) PUDONG NEW AREA SHANGHAI 201201 201201

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jia, Changzheng Shanghai, CN 4 0
Li, Shoutian Shanghai, CN 22 185
Ren, Xiaoming Shanghai, CN 37 538

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