Wafer placement table

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266557
APP PUB NO 20230154781A1
SERIAL NO

17816006

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Abstract

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A wafer placement table includes an alumina base that has a wafer placement surface on its upper surface, and incorporates an electrode; a brittle cooling base bonded to a lower surface of the alumina base; and a ductile connection member stored in a storage hole, opened in a lower surface of the cooling base, in a state of restricted axial rotation and in a state of engaging with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTD2-56 SUDA-CHO MIZUHO-KU NAGOYA-SHI AICHI 4678530 ?4678530

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Seiya Handa, JP 50 194
Kuno, Tatsuya Nagoya, JP 64 80

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