Integrated devices in semiconductor packages and methods of forming same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266619
APP PUB NO 20230369259A1
SERIAL NO

18358991

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Abstract

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An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Shou Zen Hsinchu, TW 19 173
Liu, Chung-Shi Hsinchu, TW 824 11367
Shih, Chao-Wen Zhubei, TW 167 1084
Wu, Kai-Chiang Hsinchu, TW 189 1064
Yu, Chen-Hua Hsinchu, TW 2207 47923

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