Method of manufacturing semiconductor structure having hybrid bonding pad

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12266622
APP PUB NO 20230402413A1
SERIAL NO

17840081

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Abstract

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The present disclosure provides a method of manufacturing a semiconductor structure. The method includes providing a first semiconductor substrate. The method also includes forming a first conductive pad over the first semiconductor substrate. The method further includes forming a first hybrid bonding pad on the first conductive pad, wherein the first hybrid bonding pad includes nano-twins copper, and a thickness of the first hybrid bonding pad is less than a thickness of the first conductive pad.

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Patent Owner(s)

  • NANYA TECHNOLOGY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lo, Yi-Jen New Taipei, TW 35 27

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