Wiring board

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12267953
APP PUB NO 20230171883A1
SERIAL NO

17992081

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes an insulating layer that is formed by using insulating resin and a wiring layer that is formed on a surface of the insulating layer. The wiring layer includes a first area in which a wire is formed, and a second area that includes a pad to which the wire formed in the first area is connected and that has a smaller wire width than the first area. The insulating layer includes a conductor portion that is formed by using a conductor in only a range that overlaps with the second area in plan view, and that is sandwiched between insulating resin.

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First Claim

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chino, Yukari Nagano, JP 4 38
Ito, Hideki Nagano, JP 233 1863

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