Semiconductor device, power conversion apparatus, moving body, and method for producing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12267955
APP PUB NO 20230164915A1
SERIAL NO

17906695

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Abstract

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An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ELECTRIC CORPORATIONCHIYODA-KU TOKYO 100-8310

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashihata, Takeshi Fukuoka, JP 3 0

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