Electronic component sub-mount and electronic device using the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12267960
APP PUB NO 20230128068A1
SERIAL NO

18047337

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
LEXTAR ELECTRONICS CORPORATION6F NO 21 LIXING RD HSINCHU SCIENCE PARK HSINCHU 300094

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ming-Jing Hsinchu, TW 9 17

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