Semiconductor device and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Apr 5, 2001
app pub date -
Dec 4, 2000
filing date -
Oct 16, 1997
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor device is provided which includes an upper semiconductor chip and a lower semiconductor chip attached to the upper semiconductor chip. The upper semiconductor chip is formed with a first connection pad, while the lower semiconductor chip is formed with a second connection pad. The semiconductor device also includes a deformable stud bump made of gold and arranged between the first and the second connection pads. The deformable stud bump includes an upwardly pointed portion before it is pressed and deformed by the first connection pad of the upper semiconductor chip. The pointed portion serves to break through an oxide film formed on the first connection pad of the upper semiconductor chip. The semiconductor device further includes an adhesive resin layer applied between the upper and lower semiconductor chips.
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