Apparatus and method for feeding slurry

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United States of America Patent

PATENT NO 6585560
SERIAL NO

09731011

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Abstract

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A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by a CMP polisher, the controller continuously operates the pump. On the other hand, while the polisher is idling, the controller starts and stops the pump intermittently at regular intervals. No stirrer like a propeller is inserted into the slurry bottle, but the slurry is stirred up by spraying the slurry through the spray nozzle.

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Patent Owner(s)

  • GODO KAISHA IP BRIDGE 1;MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Shin Osaka, JP 58 998
Hidaka, Yoshiharu Toyama, JP 24 267
Tanoue, Akihiro Toyama, JP 17 72

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