Importance

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Abstract

An integrated circuit chip (10) includes a substrate (12), a plurality of transistors (16) provided in the substrate (12), a circuit pattern (14) provided on a top surface of the substrate (12) and a metal layer (42) comprising at least two metals in substantially eutectic proportions provided on a bottom surface of the substrate, the bottom surface of the metal layer (42) being exposed. The integrated circuit chip (10) can be attached to a farther substrate, e.g., a housing, using automated attachment techniques. The chip (10) can be attached to the housing by picking up the integrated circuit chip (10) with the metal layer (42) provided on the bottom surface thereof and placing the integrated circuit chip (10) onto a housing so the bottom surface of the integrated circuit chip (10) faces the housing with the metal layer (42) there between; and then heating the metal layer (42) to a temperature above its eutectic temperature to melt the metal layer and attach the integrated circuit chip (10) to the housing.

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First Claim