US Patent Application No: 2001/0000,586
Number of patents in Portfolio can not be more than 2000
Technique for chemical mechanical polishing silicon
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May 3, 2001
Publication date -
Nov 29, 2000
filing date -
09/728,813
serial no -
ABAN
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Abstract
Chemical mechanical polishing of a silicon layer, such as a polycrystalline silicon, is improved by initially chemical mechanically polishing the silicon layer with an oxide-polishing slurry. Then the silicon layer is chemical mechanically polished with a silicon-polishing slurry until the substrate is planarized.
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First Claim
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