Technique for chemical mechanical polishing silicon
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United States of America Patent
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app pub date -
Nov 29, 2000
filing date -
Jun 13, 1998
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Abandoned
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Abstract
Chemical mechanical polishing of a silicon layer, such as a polycrystalline silicon, is improved by initially chemical mechanically polishing the silicon layer with an oxide-polishing slurry. Then the silicon layer is chemical mechanically polished with a silicon-polishing slurry until the substrate is planarized.
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