Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer
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United States of America Patent
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Feb 26, 2002
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N/A
app pub date -
Dec 26, 2000
filing date -
Aug 11, 1999
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Abstract
The present invention is directed to the field of semiconductor processing and, more particularly, to a method of planarizing or polishing process layers formed above a surface of a semiconducting substrate. In one illustrative embodiment, the method comprises determining the thickness of a process layer formed above a semiconducting substrate and determining a polishing recipe for said process layer based upon the measured thickness of said process layer.
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