Supplemental heat mechanisms are employed to ensure that refrigerant in evaporative cold plates for electronic modules not only returns to the compressor in a vapor phase but also further operates to maintain electronic circuit junction temperatures at relatively constant temperature levels. Furthermore, the supplemental heating system responds within a time frame which is faster than other methods which may be employed to achieve the same or similar objectives. In particular, in preferred embodiments of the present invention pressure and temperature measurements of refrigerant exiting the evaporative cold plate are employed to control the turning on of supplemental electrical resistive heating elements to make up for thermal dissipation fluctuations occurring in the electronic module. The supplemental heat may be provided either with a single flat element or through the use of in-line heating elements. The supplemental heating mechanism provides a method for insuring that refrigerant material is returned to the compressor in a vapor state so as to particularly not adversely affect compressor life and/or operating efficiency.
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