Mounting arrangement for multilayer electronic part
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United States of America Patent
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-
Apr 30, 2002
Issued Date -
N/A
app pub date -
Jan 10, 2001
filing date -
Aug 25, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip capacitor includes a multilayer body composed of a plurality of stacked sheet layers made of ceramics; capacitor electrodes and via hole electrodes disposed inside the multilayer body; and outer electrodes formed on only main surfaces of the multilayer body such that they are electrically connected to the capacitor electrodes via the via hole electrodes. Some of the capacitor electrodes are electrically connected by the via hole electrodes, and the other capacitor electrodes are electrically connected by other via hole electrodes.
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