Connecting structure for covered wires

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6381840
SERIAL NO

09756795

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A connecting structure of covered wires is provided. A ground wire 2 is overlaid by a shield wire 1 such that the wires cross each other. Respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1,2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper resin tip 13 isS provided, on a periphery of the butt face, with a projection 13b. One the other hand, the lower resin tip 14 has a recess 14b formed on a periphery of the butt face, for engagement with the projection 13b. Owing to the provision of the projection 13b and the recess 14b, it is possible to exclude a possibility that the upper resin tip 13 deviates from the lower resin tip 14 during the ultrasonic oscillation.

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Patent Owner(s)

  • YAZAKI CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ide, Tetsuro Shizuoka-ken, JP 45 674

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