Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 11, 2002
Grant Date -
May 17, 2001
app pub date -
Dec 12, 2000
filing date -
Mar 27, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
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