Method of connecting covered wires

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6662445
SERIAL NO

09759526

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In this method, a ground wire 2 is overlaid on a shield wire 1 in cross. Next, overlapping portions of the shield wire 1 and the ground wire 2 are interposed between an upper resin tip 13 and a lower resin tip 14. By executing a first ultrasonic oscillation while inserting a projection 7a of an ultrasonic horn 7 into a through hole 13b of the tip 13, outside rinds 1d, 2b of the wires 1, 2 are removed in the vicinity of the overlapping portions. Next, by arranging a low-melting metal 15 and a resin piece 16 on a contact between the braided wire 1c and the core line 2a and executing a second ultrasonic oscillation, the contact can be brazed with the mutual welding of the tips 13, 14.

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Patent Owner(s)

Patent OwnerAddress
YAZAKI CORPORATIONTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Takashi Shizuoka-ken, JP 145 1866
Tanikawa, Satoshi Shizuoka-ken, JP 5 85

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