Method of forming electrical interconnects having electromigration-inhibiting plugs

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6678951
APP PUB NO 20010001427A1
SERIAL NO

09735566

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method is provided for forming an electrical conductors, comprising forming electrically conductive segments incorporating electromigration-inhibiting plugs. A row of windows is formed in a planar surface and electromigration-inhibiting material is deposited over the planar surface and into the windows to provide electromigration-inhibiting plugs in the windows. The plugs may be formed by depositing an electromigration-inhibiting liner in the windows and then depositing electrically conductive material to fill the windows. Portions of either or both of the plugs and conductive segments are removed such that the plugs and conductive segments have a coplanar surface. The plugs may be formed in windows in an electrically conductive layer defining the conductive segments. Alternatively, windows may be formed in a dielectric layer and the conductive segments formed from electrically conductive material deposited in trenches in the dielectric between neighboring windows, the plugs, conductive segments and dielectric surface being coplanar. Embodiments of the method may be employed in manufacture of integrated circuit conductors.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX8793

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Atakov, Eugenia Acton, MA 4 50
Bair, Lawrence Littleton, MA 4 50
Clement, John Westboro, MA 9 109
Gieseke, Bruce Ashland, MA 8 66
Shepela, Adam Bolton, MA 6 89

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 5306872 Structures for electrically conductive decals filled with organic insulator material 13 1992
5363550 Method of Fabricating a micro-coaxial wiring structure 74 1992
 
NEC CORPORATION (1)
5889233 Multilayer wiring structure 8 1996
 
SUMITOMO METAL INDUSTRIES, LTD. (1)
5600884 Method of manufacturing electrical connecting member 19 1993
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
5666722 Method of manufacturing printed circuit boards 56 1995
 
FREESCALE SEMICONDUCTOR, INC. (1)
5760476 Interconnect run between a first point and a second point in a semiconductor device for reducing electromigration failure 18 1996
 
CORNELL UNIVERSITY (1)
5439731 Interconnect structures containing blocked segments to minimize stress migration and electromigration damage 95 1994
 
KAWASAKI MICROELECTRONICS, INC. (1)
5973402 Metal interconnection and method for making 32 1997
 
LOCKHEED MARTIN CORPORATION (1)
5745984 Method for making an electronic module 363 1995
 
World Properties, Inc. (1)
5329695 Method of manufacturing a multilayer circuit board 70 1992
 
FLUKE CORPORATION (1)
4861640 Molded circuit board and manufacturing method therefor 15 1988
 
LG Semicon Co., Ltd. (1)
5663102 Method for forming multi-layered metal wiring semiconductor element using cmp or etch back 21 1996
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (11)
* 2011/0101,534 AUTOMATED SHORT LENGTH WIRE SHAPE STRAPPING AND METHODS OF FABRICTING THE SAME 5 2009
8211776 Integrated circuit line with electromigration barriers 11 2010
* 2011/0163,450 INTEGRATED CIRCUIT LINE WITH ELECTROMIGRATION BARRIERS 0 2010
8558284 Integrated circuit line with electromigration barriers 0 2012
9076847 Selective local metal cap layer formation for improved electromigration behavior 0 2013
9123726 Selective local metal cap layer formation for improved electromigration behavior 0 2013
9536779 Selective local metal cap layer formation for improved electromigration behavior 0 2015
9455186 Selective local metal cap layer formation for improved electromigration behavior 0 2015
9431293 Selective local metal cap layer formation for improved electromigration behavior 0 2015
9406560 Selective local metal cap layer formation for improved electromigration behavior 0 2015
9385038 Selective local metal cap layer formation for improved electromigration behavior 0 2015
 
GLOBALFOUNDRIES INC. (3)
9536830 High performance refractory metal / copper interconnects to eliminate electromigration 0 2013
9305879 E-fuse with hybrid metallization 3 2013
9171801 E-fuse with hybrid metallization 1 2014
* Cited By Examiner