Method and apparatus for removing residual material from an alignment mark of a semiconductor wafer
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United States of America Patent
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Sep 11, 2001
Grant Date -
May 24, 2001
app pub date -
Dec 11, 1998
filing date -
Dec 11, 1998
priority date (Note) -
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Abstract
A method of exposing an alignment mark defined in a first side of a semiconductor wafer includes the step of engaging a second side of the wafer with a wafer chuck. The method also includes the step of positioning the wafer in a chamber having a photochemical reactant gas present therein during the engaging step. Moreover, the method includes the step of impinging laser beams on the first side of the wafer such that a reactant specie is generated from the photochemical reactant gas. Yet further, the method includes the step of removing material from the first side of the wafer with the reactant specie. An apparatus for exposing an alignment mark defined in a first side of a semiconductor wafer is also disclosed.
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