Lossy RF shield for integrated circuits

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6734045
APP PUB NO 20010001592A1
SERIAL NO

09753703

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A low-cost EMI shield that fits around an integrated circuit package to absorb electromagnetic energy and dissipate it as heat. The shield is not ohmically conductive so it may contact electrically active conductors without affecting the operation of the circuit. EMI is prevented from being radiated by and around an integrated circuit package by a perimeter of material that is lossy to high-frequency electromagnetic currents. This perimeter is fitted around an integrated circuit package such that the gap between a heat sink or other top conductor and the printed circuit board is completely closed by the lossy material. This provides not only a line-of-sight obstruction to RF currents, but also provides a lossy return path to close the circuit loop for currents on the skin of the heat sink. Since the material is lossy, rather than purely conductive, it can be used with a less than perfect ground attachment. Grounding is accomplished by the placement of the lossy material adjacent to the printed circuit board, allowing capacitive coupling to close the loop. The position of the lossy material is secured by a friction fit, adhesive, or self-locking or retaining features built into the lossy material.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX8793

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morris, Terrel L Garland, TX 54 423

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 5249101 Chip carrier with protective coating for circuitized surface 104 1992
 
MICRON TECHNOLOGY, INC. (2)
* 5866953 Packaged die on PCB with heat sink encapsulant 158 1996
* 6117797 Attachment method for heat sinks and devices involving removal of misplaced encapsulant 81 1998
 
TESSERA, INC. (1)
* 6309915 Semiconductor chip package with expander ring and method of making same 56 1999
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
STATS CHIPPAC PTE. LTE. (5)
7537962 Method of fabricating a shielded stacked integrated circuit package system 25 2006
* 2008/0150,093 SHIELDED STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM 4 2006
8018040 Shielded stacked integrated circuit packaging system and method of manufacture thereof 5 2009
* 2009/0194,853 SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 1 2009
8368200 Shielded stacked integrated circuit packaging system and method of manufacture thereof 0 2011
 
LAIRD TECHNOLOGIES, INC. (1)
9622338 Frequency selective structures for EMI mitigation 0 2015
* Cited By Examiner