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Abstract

A method of forming an improved isolation trench between active regions within the semiconductor substrate. The improved method incorporates a trench liner having a nitrogen content of approximately 0.5 to 2.0 percent. A pad layer is formed on a silicon substrate and a nitride layer is formed on the pad layer. Thereafter, a photoresist layer is patterned on the silicon nitride layer such that regions of the nitride layer are exposed where an isolation trench will subsequently be formed. Next, the exposed regions of the nitride layer and the pad layer situated below the exposed regions of the nitride layer are etched away to expose regions of the silicon substrate. Subsequently, isolation trenches are etched into the silicon substrate with a dry etch process. A trench liner is then formed and nitrogen incorporated into the trench liner. Incorporation of nitrogen into the trench liner can be accomplished by either forming the trench liner in the presence of a nitrogen bearing ambient or by forming a pure SiO.sub.2 trench liner and subsequently implanting the SiO.sub.2 trench liner with nitrogen. After formation of the nitrogenated trench liner, the trench is filled with a dielectric preferably comprised of a CVD oxide. Thereafter, the CVD fill dielectric is planarized and the nitride layer is stripped away.

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First Claim