PROCESS OF FINAL PASSIVATION OF AN INTEGRATED CIRCUIT DEVICE

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United States of America Patent

APP PUB NO 20010001727A1
SERIAL NO

09060192

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Abstract

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A process for forming a final passivation layer over an integrated circuit comprises a step of forming, over a surface of the integrated circuit, a protective film by means of High-Density Plasma Chemical Vapor Deposition.

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Patent Owner(s)

Patent OwnerAddress
SGS-THOMSON MICROELECTRONICS S R LAGRATE BRIANZA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DE, SANTI GIORGIO MILANO, IT 9 101
ZANOTTI, LUCA AGRATE BRIANZA, IT 15 192

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