Multi-connectable printed circuit board
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United States of America Patent
Stats
-
Aug 7, 2001
Grant Date -
May 24, 2001
app pub date -
Aug 31, 1999
filing date -
Aug 31, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-connectable printed circuit assembly, comprising: (a) a printed circuit substrate 11 having a first edge 22 and first and second edge regions 44/55, wherein at least the first edge region 44 is defined along the first edge 22; (b) a first array 77 of electrical connection features 66 disposed on or within the substrate proximate the first edge region 44; (c) a second array 88 of electrical connection features 66 disposed on or within the substrate proximate the second edge region 55, wherein the second array 88 is substantially a duplication or a mirror image of the first array 77; and (d) a plurality of circuit traces 99 disposed on or within the substrate such that each electrical connection feature 66 of the first array 77 is connected by one of the circuit traces 99 to a corresponding electrical connection feature 66 of the second array 88.
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