Importance

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Abstract

The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface. The method comprises the steps of mounting and contacting a semiconductor chip with a pressure sensor on a substantially planar chip carrier surface of a chip carrier; placing a chimney-shaped connection piece onto the semiconductor chip to project upward from a pressure-detecting surface of the pressure sensor and to expose the pressure-detecting surface to a pressure to be measured, and pressure-tightly enclosing at least the pressure-detecting surface of the pressure sensor with an end of the connection piece bearing on the semiconductor chip; and encapsulating the pressure sensor component with a component encapsulation of an electrically insulating material, the component encapsulation enclosing one of the semiconductor chip and the chip carrier and enclosing a portion of the connection piece.

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First Claim