Method of producing a pressure sensor component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jan 17, 2001
filing date -
Feb 25, 1997
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface. The method comprises the steps of mounting and contacting a semiconductor chip with a pressure sensor on a substantially planar chip carrier surface of a chip carrier; placing a chimney-shaped connection piece onto the semiconductor chip to project upward from a pressure-detecting surface of the pressure sensor and to expose the pressure-detecting surface to a pressure to be measured, and pressure-tightly enclosing at least the pressure-detecting surface of the pressure sensor with an end of the connection piece bearing on the semiconductor chip; and encapsulating the pressure sensor component with a component encapsulation of an electrically insulating material, the component encapsulation enclosing one of the semiconductor chip and the chip carrier and enclosing a portion of the connection piece.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully