US Patent Application No: 2001/0002,339

Number of patents in Portfolio can not be more than 2000

SUBSTRATE COATING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD OF IMPROVING UNIFORMITY OF LIQUID DEPOSITION

ALSO PUBLISHED AS: 6232247

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Abstract

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In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface. Gravity biases the shaping members downward until an angular velocity of the substrate support provides a force to bias each shaping member upward adjacent the substrate to establish a circular surface.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID21560

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gordon, Brian F Boise, ID 41 150
Shirley, Paul D Meridian, ID 39 95

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