SUBSTRATE COATING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD OF IMPROVING UNIFORMITY OF LIQUID DEPOSITION

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United States of America Patent

PATENT NO 20010002339
APP PUB NO 20010002339A1
SERIAL NO

09410969

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In one aspect, the invention includes a method of improving uniformity of liquid deposition when a liquid is spin-coated over a non-circular substrate. The substrate is retained on a platform and spun. The circular platform includes a plurality of shaping members pivotally connected to the platform. The plurality of shaping members are biased by spinning the platform to form a platform surface with a circular periphery. In another aspect, the invention includes a substrate coating apparatus. Such apparatus comprises a non-circular substrate support configured to support a substrate with a planar surface and non-circular periphery. The apparatus further comprises a motor configured to spin the substrate support. A plurality of shaping members are pivotally connected with the substrate support and each shaping member has a curved outer side surface. Gravity biases the shaping members downward until an angular velocity of the substrate support provides a force to bias each shaping member upward adjacent the substrate to establish a circular surface.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID18930

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GORDON, BRIAN F Boise, US 30 235
SHIRLEY, PAUL D Meridian, US 29 122

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