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United States of America Patent

PATENT NO 6956174
SERIAL NO

09295269

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at lease a portion of the conductive contact terminal immediately adjacent the first intimate bond.

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Patent Owner(s)

  • FORMFACTOR, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Khandros, Igor Y Peekskill, NY 226 18932
Mathieu, Gaetan L Carmel, NH 190 12779

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